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Frequency behavior of ground plane via interconnections in multilayer LTCC-modulesTHELEMANN, T; THUST, H.SPIE proceedings series. 1997, pp 350-355, isbn 0-930815-50-5Conference Paper

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TSV constraints related to temperature excursion, pressure during molding, materials used and handling loadsFATAT, Tomasz; FRIEDEL, Kazimierz; MARENCO, Norman et al.Microsystem technologies. 2009, Vol 15, Num 1, pp 181-190, issn 0946-7076, 10 p.Article

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